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Cost-effective X-ray inspection of electronic components

The XT V 130C is a highly flexible and cost-effective electronics and semiconductor inspection system. The system features a 130kv/10 watt  Nikon Metrology manufactured source, a globally recognized open tube design with integrated generator, and a high-resolutionimaging chain.

Through a series of factory and field upgrades, the end-user can configure these systems to its own needs with a higher power source, a rotating sample tray, automatic inspection software, a digital flat panel option, and the ability to add future-proof CT technology.

 

Key benefits

  • Proprietary 30-130kv micro-focus source with 2μm feature recognition
  • True 75° manipulator tilting angle allows oblique viewing for easy inspection of internal features
  • Large measurement area of 406x406mm
  • Intuitive joystick navigation drives real-time X-ray imaging
  • Dual display for combined measurement and real-time analysis
  • Low cost of ownership and maintenance with open-tube technology
  • Safety as a design criterion
  • CT ready

 

Key Features


_XT-V130-microfocus-X-ray-source

Proprietary 30-130kV micro-focus with 3μm spot size and 2μm feature recognition

The microfocus source is equipped with a reflection target, offering a 3 micron spot size. XT V 130 system uses an vertical mounted, open-tube X-ray source that guarantees a low cost-of-ownership. The advanced electromagnetic lens is computer controlled to ensure that the image remains in focus at all kV settings and the target does not burn when using highest powers.

 

movement

True parallel tracking for best views of BGA analysis

A combination of tilt and rotate is required to give the best unobstructed view of BGA balls. The next step is to scan along the rows to inspect for failures. With standard manipulators, this necessitates the simultaneous operation of 3 axes – requiring considerable skill on behalf of the operator.
X-Tek’s true parallel tracking maintains the X and Y axes parallel to the BGA, allowing the rows to be scanned using a single X or Y axis. This feature is enabled as part of the advanced system control concept.

 

_True-concentric-imaging

True concentric imaging

The operator chooses a region of interest (ROI) to inspect and positions it in the centre of the screen. Under any combination of rotate, tilt and magnification, the ROI remains completely locked into the center of the field of view.
The true concentric imaging feature operates over the entire scan area of the manipulator. The ROI stays locked in, regardless of the sample’s position on the manipulator table, ideal for inspecting around single or multiple BGA balls.

 

BGA at tilt angle 0 degrees  BGA at tilt angle 45 degrees BGA at tilt angle 60 degrees

BGA at tilt angle 0                                 degrees BGA at tilt angle 45                   degrees BGA at tilt angle 60 degrees

 

 

High quality imaging chain reveals all defects

  • The XT V 130C system incorporates all features to generate high quality images from electronic samples
  • Leading proprietary micro-focus source technology
  • 320x image magnification enables users to zoom in on any specific item of interest
  • 1Mpixel 12bit camera with 6” image intensifier
  • Accurate control of the power and direction of the emitted X-ray beams
  • Qualitative real time X-ray imager (25 frames per second)

Zoom factor 5x Zoom factor 16x Zoom factor 150x

Zoom factor 5x                                    Zoom factor 16x                                  Zoom factor 150x

 

 

 

 

 

_Easy-accessible-X-ray-measurement-volume

Comfortable measurement area of 406x406mm

The measurement volume is easily accessible through a large hinged door and can easily hold larger boards or multiple components for automated inspection.

 

 

Inherently safe system, does not require special precautions or badges

The XT V 130C incorporates the most advanced image capture and analysis software running on the latest specification processing hardware. The resulting data can be saved or exported directly any COM compliant package e.g. Word, Excel, Access and SPC systems . Processing hardware and software are both controlled in-house so that advances in technology can be passed on to the user without delay.
Inspect-X includes special functions for inspection of semiconductor package voids, wire bonding and BGA solder bumps. It also makes use of Microsoft VBA as a scripting/macro language, allowing rapid software customisation to suit specific inspection requirements.

inspect-x  bga_void  Electronics_2

 

Low-cost-of-ownership

Low cost of ownership

X-Tek’s open X-ray tube development has driven down the size, weight and cost of the system whilst maintaining superior quality and performance. By introducing a patented zero-maintenance cable-less HT generator, the preventative maintenance has been dramatically reduced making the long term cost of ownership considerably lower than any comparable system.
And with a footprint of only two square metres, XT V 130C’s volume provides a generous 406mmx406mm (16”x16”) scan area in a system.

Advanced ergonomics for ease of use

The XT V 130C has been designed for ease-of-use without compromising performance.
Fully adjustable shelves ensure that all system controls are at the operator’s fingertips whether standing or sitting, independent of the person’s height.
The Windows control screen is laid out logically with all regularly used functions in view on single click buttons while movement of the precision joysticks gives a direct and logical response from both sample manipulator and X-ray image.
The system is highly intuitive to operate and as a result, operator training time is significantly reduced.

Ready for CT applications (option)

XT V 130C is pre-configured to turn the system into a CT system. This way 3D images can be reconstructed to gain even more insight into components and sub-assemblies.

 

BGA_VoidsBond_WiresElectronics_5Electronics_o3

 

 

XT V 130C Specifications

Max kV: 130 kV
Max. electron beam power: 10W
X-ray source: Open transmission target tube
X-ray spot size: 3µm
Defect recognition capability: 2µm
Geometric magnification: 2.5x-2,400x
System magnification: Up to 36,000x
Imaging system (Standard): 1.54Mpixel 12bit camera with 6″ image intensifier
Imaging system (Option): Varian 1313 or 2520 Digital flat panel
1Mpixel 12bit camera with dual field 4″/6″ image intensifier
Manipulator: 4-axis (X, Y, Z, T)
Rotate axis: Optional
Tilt: 0 – 75 degrees
Measuring volume: Largest square in single map 406x406mm (16×16″)
Absolute max 711x762mm (28×30″)
Max. sample weight: 5kg (11 lbs)
Dimensions (BxWxH): 1,225 x 1,810 x 2,145mm  (48x71x84″)
(incl. monitor bracket and lamp tower)
Weight: 1,935kg (4266lbs)
Radiation safety: <1μSv/hr at the cabinet surface
Control: Inspect-X control and analysis software
Automation inspection: Optional
Computed Tomography: Optional
Applications: Real-time inspection of electronics
(BGA, µBGA, flip-chip and loaded PCB boards)